Precision Lid Cover
It is either in Unit Form and Panel Form using Thermoplastic material such as LCP, PPS,
PPA and others with Heat Deflection Temperature (HDT) > 275oC. This allowed our product withstand high
temperature in the assembly process such as Adhesive Curing, Reflow and others.
Special Surface Profile and Condition on the Precision Lid Cover can be achieved to promote the Adhesion Strength.
We also supply Very High Temperature Precision Lid Cover for high temperature soldering with temperature 350oC. Besides, with our Formulated Resin, we can supply Electrically Conductive Precision Lid Cover for purpose of EMI Shielding and Grounding.