Pre-molded Lead Frame Packages or Air Cavity Packages
This is divided to Unit Form and Panel Form. For Unit Form, it can be PDIP, SOP, SOIC,
QFN Punching and other Packages. For Panel Form, it can be QFN Sawing and other Packages.
All the Pre-molded Lead Frame Packages or Air Cavity Packages using Thermoplastic material
such as LCP, PPS, PPA and others with Heat Deflection Temperature (HDT) > 275oC.
This allowed our product withstand high temperature in the assembly process such as Die Attach Epoxy curing, Wire Bonding with Heater Block, Reflow and others. For the Lead Frame, we are using either Etch Lead Frame or Stamp Lead Frame make by Copper Alloy such as C194, M33 and others. Most of the Lead Frame is pre-plated with Nickel (Ni), Palladium (Pd), Gold (Au), Silver (Ag), Tin (Sn) and others.